Mfg Part Number: BCM 23C64D-8168 | Alternate P/N: BCM23C64D8168 | Manufacturer: Allegro Microsystems Inc |
NSN : 5962-01-260-3008 | Item Name : microcircuit memory | CAGE Code : 31019 |
FSC : 5962 Microcircuits Electronic |
Thank you for your interest in NSN Part BCM 23C64D-8168 of Microcircuit Memory at Automatic Aerospace. This Allegro Microsystems Inc manufacturer item is listed alongside with NSN 5962-01-260-3008 and part BCM 23C64D-8168 for your reference. As this product is currently available, we encourage you to take advantage of our Instant RFQ service in order to acquire a competitive quote for your comparisons. With 24/7x365 team member availability, responses to requests or inquiries are completed with haste.
Explore our listings at your leisure and you will find that the part BCM 23C64D-8168 of NSN 5962-01-260-3008 can be found listed under CAGE Code 31019. However, we carry an array of other NSN parts, all of which have been sourced from reputable distributors like Allegro Microsystems Inc. Kickoff the purchasing process with a quote request that includes all of your part requirements and see how Automatic Aerospace can serve as your go-to sourcing solution. For additional questions, call or email us directly; we are on standby for our customers.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-260-3008 Item Description: Microcircuit Memory | 5962 | 012603008 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Bcm 23c64d-8168 | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.595 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.165 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | 5895-01-146-6736 DIGITAL COMMUNI |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 325.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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