Mfg Part Number: FL3351-1DM1 | Alternate P/N: FL33511DM1 | Manufacturer: Lansdale Semiconductor Inc |
NSN : 5962-01-223-2952 | Item Name : microcircuit memory | CAGE Code : 58625 |
FSC : 5962 Microcircuits Electronic |
Thank you for your interest in NSN Part FL3351-1DM1 of Microcircuit Memory at Automatic Aerospace. This Lansdale Semiconductor Inc manufacturer item is listed alongside with NSN 5962-01-223-2952 and part FL3351-1DM1 for your reference. As this product is currently available, we encourage you to take advantage of our Instant RFQ service in order to acquire a competitive quote for your comparisons. With 24/7x365 team member availability, responses to requests or inquiries are completed with haste.
Explore our listings at your leisure and you will find that the part FL3351-1DM1 of NSN 5962-01-223-2952 can be found listed under CAGE Code 58625. However, we carry an array of other NSN parts, all of which have been sourced from reputable distributors like Lansdale Semiconductor Inc. Kickoff the purchasing process with a quote request that includes all of your part requirements and see how Automatic Aerospace can serve as your go-to sourcing solution. For additional questions, call or email us directly; we are on standby for our customers.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-223-2952 Item Description: Microcircuit Memory | 5962 | 012232952 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Fl3351-1dm1 | 3 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 1.490 INCHES MINIMUM AND 1.510 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.565 INCHES MINIMUM AND 0.590 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.110 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -55.0/+150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | COMMUNICATIONS CONTROL CENTER AN/TSQ-111 |
CBBL | FEATURES PROVIDED | 3-STATE OUTPUT AND W/ENABLE AND ASYNCHRONOUS AND HERMETICALLY SEALED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.3 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | FIRST-IN FIRST-OUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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