Mfg Part Number: WS57C64F-70D | Alternate P/N: WS57C64F70D | Manufacturer: Waferscale Integration Inc |
NSN : 5962-01-319-0513 | Item Name : microcircuit memory | CAGE Code : 66579 |
FSC : 5962 Microcircuits Electronic |
Thank you for your interest in NSN Part WS57C64F-70D of Microcircuit Memory at Automatic Aerospace. This Waferscale Integration Inc manufacturer item is listed alongside with NSN 5962-01-319-0513 and part WS57C64F-70D for your reference. As this product is currently available, we encourage you to take advantage of our Instant RFQ service in order to acquire a competitive quote for your comparisons. With 24/7x365 team member availability, responses to requests or inquiries are completed with haste.
Explore our listings at your leisure and you will find that the part WS57C64F-70D of NSN 5962-01-319-0513 can be found listed under CAGE Code 66579. However, we carry an array of other NSN parts, all of which have been sourced from reputable distributors like Waferscale Integration Inc. Kickoff the purchasing process with a quote request that includes all of your part requirements and see how Automatic Aerospace can serve as your go-to sourcing solution. For additional questions, call or email us directly; we are on standby for our customers.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-319-0513 Item Description: Microcircuit Memory | 5962 | 013190513 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Ws57c64f-70d | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 1.280 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.355 INCHES NOMINAL |
ABMK | OVERALL WIDTH | 0.620 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.550 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | +0.0 TO 70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN AND ERASABLE AND HIGH PERFORMANCE AND HIGH SPEED AND LOW POWER AND PROGRAMMABLE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
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